GSI編碼器,GSI激光系統.

GSI Group invented wafer marking processes over 25 years ago and continually innovate solutions for new substrate materials, larger wafer diameters, wafer-level die marking and factory automation. The world’s silicon suppliers, wafer reclaim, and semiconductor manufacturers consistently come to us for unsurpassed mark quality with our hardmark and patented SuperSoftMark? processes. We continue this tradition of innovation and leadership with our new-generation die marking system, the WaferMark CSP200. Designed for the emerging requirements of DCA applications, our latest system incorporates integrated mark verification and laser positioning accuracies required for continued device miniaturization. WaferMark? Products Include: WaferMark? CSP200 - 100 — 200mm Wafer Level Die Marking System WaferMark? SigmaClean? 300 FOUP - 300mm Automated Wafer Marking System WaferMark? SigmaDSC? - 100 — 300mm Hard Mark Wafer Marking System WaferMark? SigmaClean? - 100 — 200mm Soft Mark Wafer Marking System